印制电路板的导电阳极丝检测与预防

Test and prevention of conductive anode filament in PCBs

随着电子产品的多功能化和便携化,印制板导线、间距、钻孔直径,焊盘尺寸越来越小;以及绝缘层薄,信号传输快,工作电压低电流大,板内发热量高等;这些因素诱发了离子迁移,成为电子产品最重大的隐患之一。文章就CAF产生机理、检测及预防进行概述,解析CAF在印制板加工过程中控制的必要性。

With the increasing versatility and portability of electronic products, printed circuit board wires, spacing, diameters of drill holes, and land sizes are getting smaller and smaller. And the boards have thin insulation layer, fast signal transmission, low operating voltage, high current, high heat inside the board. These factors induced ion migration, and ion migration has become one of the most important hidden dangers of electronic products. This article gives an overview of CAF generation mechanism, detection and prevention, and analyzes the necessity of CAF control in the processing of printed boards.