0402封装元件SMT焊接缺陷分析及改进

Analysis and Improvement of SMT Welding Defects of 0402 Packaging Components

随着元件的小型化及自动化生产能力的提升,对电路设计人员的要求也越来越高,如果PCB设计时不考虑可制造性,势必会在生产中造成大量焊接缺陷。结合生产数据,以某产品上0402元件焊盘设计不合理造成的焊接缺陷为例进行分析,针对不同的设计缺陷提出了相应的改进方法。

With the miniaturization of components and the improvement of automation production capacity, the requirements for circuit designers are becoming higher and higher. If manufacturability is not considered in PCB design, a large number of welding defects will inevitably occur in production. Based on the production data, the welding defects caused by the unreasonable design of the pad of 0402 component in a product were analyzed, and the corresponding improvement methods were put forward for different design defects.