微电子封装设备数据采集技术

Data Acquisition Technology of Microelectronics Packaging Equipment

微电子封装设备是结构复杂和制造精度高的电子工艺装备,设备运行过程中产生大量数据,数据采集是设备智能化发展的基础。目前还无法获取设备用户现场的实时数据。重点论述了设备数据智能感知、传输网络设计和数据管理与应用等技术,提出了可行的微电子封装设备数据采集系统方案。采用先进的数据采集以及数据处理和挖掘技术,能大幅度提高设备采集数据的数量和质量。

As a complicated-structure and a high manufacturing precision electronic manufacturing technique equipment, a host of data will be produced when the microelectronics packaging equipment is in motion. Data acquisition is the basis of the intelligent development of the equipment. At present, the actual time data cannot be collected at equipment user worksite. The techniques of intelligence perception of equipment data, transfer web design and data management and application are introduced and summarized. A feasible scheme of data acquisition system for the microelectronics packaging equipment is put forward. Adopting advanced data acquisition, data handling and digging techniques, the quantity and quality of equipment data may be greatly raised.