装配式地暖系统用陶板的优化分析

Optimization of Ceramic Plates for Assembly Floor Heating System

通过分析陶板作为装配式地暖系统发热面材料的辐射采暖传热过程,研究陶板的厚度、凹槽的距离、凹槽的半径等因素对陶板内温度场的影响,并利用ANSYS中优化分析工具箱建立影响因素与响应值之间的响应面以及影响因素对陶板温度场影响的局部灵敏度大小。分析结果表明,在满足供热温度需求的前提下,陶板凹槽距离对温度场的影响最大,在对现有的陶板进行设计时,可以对陶板凹槽距离进行设计改进,以达到陶板作为发热面饰面材料时性能最优。

By analyzing the radiant heating process of ceramsite as the heating surface material of the assembled floor heating system, the effects of the thickness of the clay plate, the distance of the groove and the radius of the groove on the temperature field of the plate are studied and optimized by ANSYS. The analysis toolbox establishes the response surface between the influencing factors and the response values and the local sensitivity of the influencing factors on the temperature field of the ceramic plate. The analysis results show that under the premise of meeting the heating temperature demand, the groove distance of the ceramic plate has the greatest influence on the temperature field. When designing the existing ceramic plate, the groove distance of the ceramic plate can be designed and improved to achieve the optimal heat radiation of the ceramic plate. The surface finish material has the best performance.