GO添加量对RGO/Cu复合材料组织与性能的影响

Effect of GO Addition on Microstructure and Properties of RGO/Cu Composite

利用湿法球磨与复压复烧方法制备RGO/Cu复合材料,研究了GO添加量(0%、0.3%、0.5%、1.0%,质量分数,下同)对RGO/Cu复合材料的组织与性能的影响。结果表明:GO较均匀分布于铜基体中,且能起到细化晶粒的作用。GO的润滑作用促进晶粒滑移与转动,填补了晶粒间隙,提升了复合材料密度,其中0.5%RGO/Cu复合材料的相对密度最大,为99.4%。添加GO后,细化晶粒引起的晶界面积扩大以及基体密度降低都增加了电子的散射,从而导致复合材料导电率下降。细晶强化和复压作用提升了复合材料强度和硬度。与纯铜相比,1.0%RGO/Cu显微硬度(80.6HV)提升了40%;0.3%RGO/Cu的抗拉强度(241.3MPa)提高了32%。若GO的添加量过大,其团聚使得复合材料的致密度降低,从而导致断后伸长率下降。

RGO/Cu composites were prepared by wet milling and repressing and re-sintering process.The effect of GO addition(0%,0.3%,0.5%,1.0%,wt%)on the microstructure and properties of RGO/Cu composites was investigated.The results reveal that GO was uniformly distributed in Cu matrix and played a role in refining grain.The lubrication of GO promoted grain sliding and rotation,filled the grain gap and improved the density of materials.The relative density of 0.5wt%RGO/Cu composites was the largest(99.4%).As the GO addition,the grain boundary area expansion caused by refined grain and Cu matrix density decrease increased the scattering of electrons,and results in the composite conductivity decreases.The strength and hardness of composites were improved by fine grain strengthening and repressing process.Compared with pure copper,the hardness of 1.0wt%RGO/Cu composites(80.6HV)was increased by 40%,the tensile strength of 0.3wt%RGO/Cu composites(241.3 MPa)was increased by 32%.However,the excess GO will agglomerate,then decrease composites elongation.