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电子元件冷却的场协同分析 被引量:3

Field Synergy Analysis of Electronic Components Cooling
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摘要 以电子元件冷却装置为研究对象,它是由内部静压箱、冷却空间、外部静压箱组成。内部静压箱外侧套着冷却空间,冷却空间外侧套着外部静压箱。内部静压箱是截面为正六边形的棱柱体空间,正六边形的边长为0.08m,外部静压箱是截面为圆环形的柱体空间,其中圆环形截面由半径为0.105m和半径为0.15m的两个圆构成。内、外静压箱之间为冷却空间。内、外静压箱一端封闭,另一端可分别接送风机或引风机,两风机异侧放置。当外部静压箱接送风机而内部静压箱接引风机时,空气从外部静压箱先经过冷却空间进风口再经过冷却空间出风口流向内部静压箱(外进内出);当内部静压箱接送风机而外部静压箱接引风机时,空气流向与外进内出相反(内进外出)。在垂直于装置中心轴的截面上,冷却空间被隔板均分为6个相同扇形区域,其中隔板沿正六边形每个顶点所在的直径布置。每个区域有4个电子元件布置在正六边形每条边的外侧。4个电子元件等间距布置,电子元件之间净距为d1,两侧电子元件与所在正六边形的边两端的水平间距为d2。基于计算流体动力学(CFD)的COMSOL Multiphysics软件,建立冷却空间二维简化模型并划分网格,对其温度场和速度场求解,研究在不同空气体积流量下改变空气的进出口方向(外进内出、内进外出)和电子元件的间距对电子元件冷却效果的影响,并结合场协同原理分析各种工况下温度场和速度场的协同程度,从而获得电子元件冷却的优化方案。计算结果表明:空气外进内出时电子元件冷却效果优于内进外出;当电子元件分布间距参数为d2/d1=1.5时,电子元件的温度最低,温度场和速度场协同程度最好,冷却效果最优。 The electronic component cooling device is taken as the research object. It is composed of internal static pressure box,cooling space and external static pressure box. The outside of the internal static pressure box is covered with cooling space,and the outside of the cooling space is covered with the external static pressure box. The internal static pressure box is a prismatic space with a regular hexagonal cross section,and the side length of the regular hexagon is 0.08 m. The external static pressure box is a cylindrical space with a circular cross section,wherein the circular cross section is composed of two circles having a radius of 0.105 m and a radius of 0.15 m. There is a cooling space between the internal and external static pressure boxes. The internal static pressure box and the external static pressure box are closed at one end,and the other end can respectively be connected to the blower or the induced draft fan,two fans are placed sideways. When the external static pressure box is connected to the blower and the internal static pressure box is connected to the induced draft fan,the air flows from the external static pressure box through the cooling space air inlet and then through the cooling space air outlet to the internal static pressure box (external inlet and internal outlet);when the internal static pressure box is connected to the blower and the external static pressure box is connected to the induced draft fan,the air direction is opposite to the external inlet and internal outlet (internal outlet and external inlet). On the section perpendicular to the central axis of the device,the cooling space is divided into six identical sector areas by the partition,where the partition is arranged along the diameter of each vertex of the regular hexagon. Each area has 4 electronic components arranged on the outside of each side of the regular hexagon. The four electronic components are equally spaced,the clear distance between the electronic components is d 1,and the horizontal spacing between the electronic components on both ends and the ends of each side of the regular hexagon is d 2. Based on CFD software COMSOL Multiphysics,a two-dimensional simplified model of the cooling space is established and meshed to solve its temperature and velocity fields. The effect of changing the direction of the inlet and outlet of air (external inlet and internal outlet,internal outlet and external inlet) and the spacing of electronic components on the cooling effect of electronic components under different air volume flows is studied. Combined with the field synergy principle,the degree of synergy between temperature field and velocity field under various working conditions is analyzed,thus obtaining an optimized solution for cooling of electronic components. The calculation results show that: the cooling effect of electronic components with the air external inlet and internal outlet is better than that of the internal inlet and external outlet;when the distribution distance of electronic components is d 2/ d 1=1.5,the temperature of the electronic components is the lowest,the synergistic effect between the velocity field and the temperature field is the best,and the cooling effect is also optimal.
作者 吉亚萍 云和明 郭训虎 JI Yaping;YUN Heming;GUO Xunhu
出处 《煤气与热力》 2019年第6期20-26,10043,共8页 Gas & Heat
关键词 COMSOL Multiphysics软件 电子元件冷却 数值模拟 场协同分析 COMSOL Multiphysics software electronic component cooling numerical simulation field synergy analysis
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