摘要
耐离子迁移性是目前市场上比较认可的印制电路板(PCB)绝缘可靠性评价依据。本文对PCB离子迁移的形成机理进行了总结,分析了材料种类、PCB的结构设计、加工、贮存等因素对PCB耐离子迁移性的影响,最后指出了目前PCB耐离子迁移性研究的不足以及未来的研究方向。
Ion migration resistance is the basis for evaluating the insulation reliability of printed circuit boards (PCB) in current market. In this paper, the formation mechanism of ion migration in PCB was summarized, and the effects of material types, structural design of PCB, processing, and storage on the ion migration resistance of PCB were analyzed. Finally, the deficiencies of current ion migration resistance researches and the research direction in the future were pointed out.
作者
周琼
方江魏
杨亚新
沈泉锦
ZHOU Qiong;FANG Jiangwei;YANG Yaxin;SHEN Quanjin(Zhejiang Wazam New Materials Group Co.,Ltd.,Hangzhou 311121,China)
出处
《绝缘材料》
CAS
北大核心
2019年第6期8-12,共5页
Insulating Materials
关键词
PCB
耐离子迁移性
绝缘可靠性
PCB
ion migration resistance
insulation reliability
