PCB短路失效分析

Short Circuit Failure Analysis of PCB

随着电子产品的微型化发展,线路板的设计尺寸也越来越小,由于电迁移引发的短路失效案件也就屡见不鲜了。针对某款PCB层与层间发生的短路不良进行了深入的分析,详细地介绍了分析的过程和手段,通过外观检查、电性测试、热点定位分析、离子切割、SEM+EDS等分析手段,发现PCB的第四层和第三层之间短路是由于阳极性玻璃纤纱漏电导致的。最后,提出了有效的改善对策,对于降低此类失效现象发现的风险,提高PCB的可靠性具有重要的意义。

With the miniaturization of electronic products, the design size of circuit board is getting smaller and smaller, and the short circuit failure cases caused by electromigration become common. The short circuit defect between layer and layer of PCB is analyzed in detail, and the process and means of analysis are introduced in detail. Through the analysis means of appearance inspection,electrical test, hot spot location analysis, ion cutting, SEM and EDS,it is found that the short circuit of the fourth and third layers of PCB is caused by CAF. Finally, effective improvement countermeasures are put forward, which is of great significance to reduce the risk of this kind of failure and improve the reliability of PCB.