控制器灌封工艺中气泡问题的剖析与解决方法

Analysis and Solutions on Bubble Defect in Control Circuit Board Potting Technology

控制器灌封工艺中产生的气泡对产品长期可靠性有着不可忽视的影响。本文针对此问题进行研究,分析控制器灌封工艺中气泡产生的原因并针对性地进行解决。通过增加控制器预热、生产设备抽真空、生产设备及管道加热,调整原材料配比,优化固化曲线后,可以有效解决聚胺脂灌封工艺中出现的气泡问题。

The bubble generated in control circuit board potting technology has significant influence on product long-term reliability. This paper researched the reasons of bubbles and proposed solutions which are enhancing the preheating of control circuit board, vacuuming the production equipment, heating the equipment and pipelines, adjusting the ratio of raw material, optimizing the curing profile.