大功率集成电路使用引线框架设计浅析

Analysis of the lead frame design for high power integrated circuits

本文分析了大功率集成电路使用的引线框架的设计要点。着重从引线框架材料选择、引线框架结构设计以及热性能设计三个方面对大功率器件用引线框架进行阐述探讨。从原理上简要地分析了框架材料的选择原则、基岛结构的设计原理以及通过热模拟对设计进行校验的方法,为同类产品的设计提供参考。

This paper analyzes the design points of the lead frame used in high-power integrated circuits, and focuses on the lead frame of high-power devices from three aspects: lead frame material selection, lead frame structure design and thermal performance design. In principle, the selection principle of frame material, the design principle of die pad structure and the method of verifying design by thermal simulation are briefly analyzed. It provides reference for the design of similar products.