数控电路板性能退化分析及可靠性统计推断研究

Study on Performance Degradation Analysis and Reliability Statistical Inference of NC Circuit Board

针对长寿命产品很难通过寿命试验和加速寿命试验获得充足的失效寿命数据的情况,以某型号的国产数控用印制电路板为试验对象,在高温高湿条件下开展了偏置电压性能退化试验。通过探讨其主要的故障模式和失效机理,建立了数控用电路板的电压应力退化失效模型,然后在对性能退化数据的统计分析研究的基础上,提出了基于退化轨迹的可靠性评估方法,并对高可靠性长寿命的数控用印制电路板进行了可靠性统计推断。最后给出了威布尔分布下的可靠性统计推断结果,验证了方法的正确性和有效性。

As it is difficult to obtain sufficient failure life data for long-lifetime products during life test and accelerated life test, a type of printed circuit board used in numerical control (NC) system is employed as research objects to conduct performance degradation test. During the test, the bias voltage is applied to NC circuit boards under high temperature and high humidity, and then the failure mode and failure mechanism of NC circuit boards are analyzed. Next, the degradation failure model related to bias voltage is built. Based on the statistical analysis on performance degradation data, a reliability evaluation method on degradation paths is proposed, and the reliability inference is made on NC circuit boards. Finally, the statistical inference results under Weibull distribution verify the validity and effectiveness.