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硬脆材料的磨粒加工仿真技术 被引量:2

Abrasive machining simulation technology for hard-brittle materials
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摘要 单晶硅等硬脆材料具有高硬度、低断裂韧性等特性,属于难加工材料,其加工表面易产生微裂纹、亚表面损伤层等缺陷。影响硬脆材料磨粒加工过程的因素复杂,一般用仿真技术来研究磨粒加工硬脆材料的去除机理等。本文概述了硬脆材料磨粒加工相关研究中广泛应用的网格法、无网格法以及网格与无网格结合方法,对比分析各仿真方法的特点及存在的局限性并提出未来的研究方向。 Hard-brittle materials such as monocrystalline silicon have high hardness,low fracture toughness and other characteristics,which belong to difficult-to-machine materials.Their machined surfaces are prone to produce micro-cracks,sub-surface damage layers and other defects.The factors affecting abrasive processing of hard-brittle materials are complex.Generally,simulation technology is used to study the removal mechanism of hard-brittle materials in abrasive processing.This paper summarizes the mesh methods,meshfree methods and the combination of mesh and meshfree methods widely used in the research of abrasive machining of hard-brittle materials.The characteristics and limitations of each simulation method are compared and analyzed,and the future research directions are put forward.
作者 李龙 葛培琪 王沛志 李宗强 LI Long;GE Peiqi;WANG Peizhi;LI Zongqiang(School of Mechanical Engineering,Shandong University,Jinan 250061,China;Key Laboratory of High-efficiency and Clean Mechanical Manufacture (Shandong University),Ministry of Education,Jinan 250061,China)
出处 《金刚石与磨料磨具工程》 CAS 北大核心 2019年第3期81-87,共7页 Diamond & Abrasives Engineering
基金 国家自然科学基金(NO.51775317)
关键词 仿真分析 硬脆材料 磨粒加工 材料去除机理 simulation analysis hard-brittle material abrasive machining material removal mechanism
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