摘要
针对典型TSV封装结构,基于有限元方法,采用MARC软件对具有特定功能的双层芯片-基板堆叠组装微系统进行了模拟分析。通过改变基板的尺寸厚度,研究关键部位的应力场与位移场分布,从而为设计工艺提供合理可靠的方案。
Based on the finite element method and MARC software, the typical TSV package structure was simulated and analyzed. By changing the size and thickness of the substrate, the stress field and displacement field distribution of key parts were studied, so as to provide a reasonable and reliable scheme for the design process.
作者
李明荣
王志海
毛亮
时海涛
LI Mingrong;WANG Zhihai;MAO Liang;SHI Haitao(No. 38 Research Institute of China Electronics Technology Corporation,Hefei 230088,China)
出处
《机械与电子》
2019年第7期24-27,共4页
Machinery & Electronics
关键词
三维集成
TSV
有限元分析
热力耦合
3D Integration
TSV
finite element analysis
thermo-mechanical coupling
