单晶组件使用寿命末期功率衰减分析

Power Attenuation Analysis of Monocrystalline Modules at the End of Their Service Life

选取在我国已经服役20年、质量可靠的一批单晶组件,对其使用寿命末期的功率衰减情况进行分析研究.对132块1996年Siemens Solar生产的单晶组件SM55,进行EL以及功率的相关测试,发现其功率平均衰减为26.7%,年平均衰减率为1.54%;采用简单的线性拟合函数方法,对功率的衰减与电流的衰减及填充因子的衰减进行拟合,发现功率的减少主要由填充因子的减少造成;研究分析组件电池片中隐裂和碎片的分布规律,发现隐裂和碎片不是引起组件功率衰减的主要因素;结合组件之前服役的环境条件,分析推断组件功率衰减主要来源于串联电阻的增加.

A batch of monocrystalline modules that have been in service for 20 years in China,were selected to study the power attenuation at the end of their service life.For 132 pieces of monocrystalline module SM55 produced by Siemens Solar in 1996,EL and power related tests were carried out.The average power attenuation was 26.7% and annual average attenuation rate is 1.54%.A simple linear fitting function was used to fit the attenuation of the power with the attenuation of the current and the attenuation of the fill factor.It was found that the power reduction was mainly due to the reduction of the fill factor.Study and analyze the distribution of cracks and fragments in the component cell,and find that cracks and fragments were not the main factors causing component power attenuation.Combined with the environmental conditions in which the components were previously serviced,it was analyzed that the component power attenuation was mainly due to the increase in series resistance.