摘要
对某集成电路在高机械冲击过载(冲击加速度为8000g^10000g、冲击脉冲宽度为2.5ms)时出现的金属封装引脚失效进行了分析。采用Proe软件建模和ANSYS结构力学软件对失效机理进行了仿真验证。根据失效机理,优化了环氧灌封工艺方法,使集成电路与其安装PCB及结构框架达到良好的一体化结构,解决了失效问题。
Integrated circuit pins failure mode of metal package under high mechanical shock overload(shock acceleration of 8000g^10000g, shock pulse width of 2.5 ms)was analyzed. The failure mechanism was simulated and verified by using Proe modeling software and ANSYS structure mechanics simulation software. According to failure mechanism,the epoxy filling process was optimized,the integrated circuit and installed PCB and structure frame attained good integration structure,and the problem of failure was solved.
作者
张君利
苏杨
李波
刘海亮
ZHANG Junli;SU Yang;LI Bo;LIU Hailiang(No.214 Institute of China North Industry Group Corporation,Suzhou 215163,China)
出处
《电子与封装》
2019年第7期4-6,12,共4页
Electronics & Packaging
关键词
集成电路
高机械冲击过载
机械应力
封装失效
灌封
integrated circuit
high mechanical shock overload
mechanical stress
package failure
encapsulation
