摘要
基于对电磁力以及热应力的解析计算公式的推导,运用ANSYS有限元仿真软件对固定电抗器顶底端面情况下的铜箔进行电磁-温度-结构耦合分析,分别得出热应力及所受总应力与应变的分布情况。进一步对电抗器的结构进行优化,综合考虑其结构强度要求与连发温度要求,确定电抗器的最优设计结构,最终通过试验验证出仿真与设计方案真实可信。
Based on the derivation of analytical formulae for electromagnetic force and thermal stress,ANSYS finite-element simulation software was used to analyze the electromagnetic-temperature-structure coupling of copper skin at the fixed top and bottom end surface.The distribution of thermal stress and the total stress and strain were obtained.The structure of reactor was further optimized,and the optimum design of the reactor was determined by taking the structural strength requirements and the temperature requirements into consideration.The credibility of simulation and design solution was verified by carrying out a test.
作者
李松乘
鲁军勇
程龙
朱博峰
LI Songcheng;LU Junyong;CHENG Long;ZHU Bofeng(National Key Laboratory of Science and Technology on Vessel Integrated Power System,Naval University of Engineering,Wuhan 430033,China)
出处
《国防科技大学学报》
EI
CAS
CSCD
北大核心
2019年第4期39-45,共7页
Journal of National University of Defense Technology
基金
国家自然科学基金资助项目(51522706,51607187)
国家重点基础研究发展计划资助项目(613262)
关键词
电磁发射
铜箔式电抗器
热应力
应力
连发温度场
electromagnetic launch
copper-skin pulse reactor
thermal-stress
stress
temperature field under continuous emission