摘要
以苯并环丁烯(Benzocyclobutene,BCB)作为键合层,采用离子注入剥离技术制备了Y36切型的单晶铌酸锂薄膜材料。经过对BCB键合层的前烘时间和退火曲线进行系统的研究,克服了由于铌酸锂和BCB之间热膨胀系数不匹配所导致的铌酸锂薄膜开裂问题,获得了高质量的Y36切型单晶铌酸锂薄膜材料。此外,通过在晶圆键合之前预先制备图形化的金属层,获得了带有下电极功能层的单晶铌酸锂薄膜,可应用于薄膜体声波谐振器等具有金属-绝缘层-金属结构的器件。
Single crystalline Y36-cut lithium niobate thin films were fabricated by means of crystal ion slicing(CIS)technique with Benzocyclobutene(BCB)as the bonding medium.The prebaking conditions of BCB and the annealing curve were systematically investigated and optimized,and high quality single crystalline Y36-cut lithium niobate thin films were obtained by overcoming the cracking problem caused by the mismatch of thermal expansion coefficients between lithium niobate and BCB.Moreover,A single crystalline lithium niobate film with bottom electrode was obtained by prefabricating a patterned metal layer before the wafer bonding,which can be applied in the devices with metal-insulator-metal structures,such as film bulk acoustic resonator.
作者
帅垚
李宏亮
吴传贵
王韬
张万里
SHUAI Yao;LI Hongliang;WU Chuangui;WANG Tao;ZHANG Wanli(State Key Laboratory of Electronic Thin Film and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2019年第7期7-12,共6页
Electronic Components And Materials
基金
国家重点研发计划项目资助(2017YFB0406402)
国家自然科学基金资助(51772044)
关键词
铌酸锂薄膜
晶圆键合
离子注入剥离技术
BCB
lithium niobate thin films
wafer bonding
crystal ion slicing technique
BCB