瞬态喷雾冷却中使用导热逆问题求解热边界条件

Solution of thermal boundary conditions using inverse heat conduction problem in intermittent spray cooling

随着电子器件的散热需求越来越大,关于液体冷却系统的研究愈发增多.瞬态喷雾冷却(ISC)是一个新颖高效的冷却IC芯片的方法.导热逆问题(IHCP)是一种通过测量介质内部的温度分布来估计表面热流密度的方法.采用IHCP计算喷雾冷却过程中随时间变化的表面热流密度.选用一维未来序列函数(SFS)方法由测量内部温度而估计表面热流密度.使用模拟温度数据来检查该计算方法的精度和误差,得到各个参数的影响规律以估计该方法对实验中求解热流密度的影响.

With the increasing demand of heat dissipation of electronic devices, the research on liquid cooling system is increasing. Intermittent spray cooling (ISC) is a novel and efficient method for cooling IC chips. The inverse heat conduction problem (IHCP) is a method for estimating surface heat flux by measuring the temperature distribution inside the medium. IHCP is used to predict the time-varying surface heat flux during the spray cooling process. The one-dimensional sequential function specification (SFS) method is used to estimate the surface heat flux by measuring the internal temperature. The accuracy and error of the calculation method are checked by the simulated temperature, and the influence rule of each parameter is obtained to estimate the effect of the method on the heat flux calculated in the experiment.