5Benfield D, Lou E, Moussa W A. A packaging solution utilizing adhesive-filled TSVs and flip-chip methods[J]. Journal of Micromechanics and Microengineering,2012, 22(6) :065009.
6Tu K N,Hsiao H Y,Chen C. Transaction from flip chip solder joint to 3D IC microbump: its effect on micmstructure anisotropy[J]. Microelectronics Reliability,2013,53(1 ):2-6.
8Marinov V R,Swenson O,Atanasov Y,et aI. Laser-assisted ultrathin die packaging: insights from a process study[J]. Microelectronic Engineering, 2013( 101 ) : 23-30.
9Lu X N,Shi T L,Xia Q,et aL Thermal conduction analysis and characterization of solder bumps in flip chip package[J]. Applied Thermal Engineering,2012(36) : 181-187.
