中温固化酚醛胶粘剂固化工艺及粘接性能研究

Study on the Curing Process and Adhesion Performance of the Moderate Temperature Curing Phenolic Adhesive

在合成改性酚醛树脂的过程中引入了活性单体间苯二酚,以多聚甲醛为固化剂,辅以耐热无机填料制备了可中温固化的耐高温改性酚醛胶粘剂。在此基础上考察了苯酚和间苯二酚的配比、固化温度和固化剂用量对体系凝胶特性和粘接性能的影响,同时对试片处理方式、溶剂烘除时间和固化压力等因素展开研究。结果表明,苯酚和间苯二酚为2∶1、多聚甲醛用量为16.5phr、固化压力不小于0.3MPa时,胶粘剂粘接喷砂处理的试片在100℃下固化6h可获得较高的粘接强度,常温剪切强度在10MPa以上,700℃仍有约2MPa的强度。

The resorcinol is introduced as an active monomer to synthesize modified phenolic resin.And with the paraformaldehyde as cure agents and heat-resistant inorganic filler,the moderate temperature curing heat-resistant phenolic adhesive is prepared.The effects of the ratio of phenol to resorcinol,curing temperature and dosage of curing agent on the gel properties and adhesion properties of the adhesive are investigated.The factors,such as treatment methods for sample,drying time for solvent and curing pressure,etc.are also studied.From the results it is shown that when the ratio of phenol to resorcinol is 2:1,the dosage of parafomraldehyde is 16.5 phr,the curing pressure is not less than 0.3 MPa,the bonded specimens which are sandblasted can obtain good adhesion strength after curing at 100℃ for 6 h.The lap shear strength is higher than 10 MPa at room temperature and is about 2 MPa at 700℃.