通信设备盒式电源模块MOS管的散热优化设计

Optimum Design of Heat Dissipation of MOS Tube in Box Power Supply Module of Communication Equipment

随着无线通信的高速发展,收发机的数量及功率不断增加。在框式基带设备中,考虑到实际布线、操作习惯以及散热风道等因素,盒式电源可能会位于风道下游。这种情况下,基带功率的提升会导致电源模块环境温度的攀升,特别是室外应用场景,系统环境温度普遍比室内高20℃左右,因此电源模块环境温度可以超过90℃。这对电源模块的可靠性应用,特别是MOS管等高应力高热耗功率器件提出了很高的散热要求。为了满足器件的应用要求,已很难从单个方面达到一步到位的效果,而结合系统自上而下的优化,将是比较理想的方向。因此,将结合实际项目,基于实际面临的严酷场景,尝试不同的散热手段,通过不断迭代及系统验证,最终满足产品的应用要求。

With the rapid development of wireless communication,the number and power of transceivers are increasing. In the frame baseband equipment,considering the actual wiring,operating habits and cooling duct and other factors,box power may be located downstream of the duct. In this case,the increase of baseband power will lead to the rise of ambient temperature of power supply module,especially in outdoor application scenarios. The ambient temperature of the system is generally about 20 degrees higher than that of indoor,so the ambient temperature of power supply module can exceed 90 degrees. This puts forward high heat dissipation requirements for reliability applications of power supply modules,especially for high stress and high heat consumption power devices such as MOS transistors. In order to meet the application requirements of devices,it is difficult to achieve one-step effect from a single aspect,and the combination of top-down optimization of the system will be an ideal direction. Therefore,based on the harsh scenarios faced by the actual project,different heat dissipation methods will be tried,through continuous iteration and system verification,and finally meet the application requirements of the product.