基体负偏压及占空比对电弧离子镀CrN薄膜表面大颗粒和厚度的影响

Effects of negative substrate bias voltage and duty ratio on macroparticles and thickness of CrN film deposited by arc ion plating

采用电弧离子镀技术在Si基体上沉积了CrN薄膜。利用扫描电镜观察薄膜的表面和截面形貌,通过Image-ProPlus图像处理软件统计扫描电镜图像中大颗粒所占比例及密度。研究了基体负偏压和脉冲占空比对CrN薄膜表面大颗粒和厚度的影响。结果表明,基体负偏压从零升高至500V时,薄膜表面大颗粒的占比和密度均不断下降,沉积速率降低;脉冲占空比从15%升高至75%时,薄膜表面大颗粒的占比先增加,而后在一定范围内波动,大颗粒密度则先增加后下降。脉冲占空比为15%时,大颗粒占比和密度均较低;脉冲占空比为75%时,大颗粒在薄膜表面的占比最高,但密度最低,表明此时大颗粒的尺寸较大。

CrN films were deposited on silicon substrates by arc ion plating technology. Their surface and cross-section morphologies were observed by scanning electron microscopy. The percentage and density of macroparticles on film surface were calculated using Image-Pro Plus, a professional image processing software. The effects of negative substrate bias voltage and duty cycle on the formation of macroparticles and CrN film thickness were studied. The results showed that both percentage and density of macroparticles as well as film deposition rate were decreased with the increasing of negative substrate bias voltage from 0 to 500 V. As duty cycle being changed from 15% to 75%, the percentage and density of macroparticles rose initially, and then the percentage fluctuated in a certain range, while the density declined gradually. Both percentage and density of macroparticles were in a low level when the duty cycle was 15%. The percentage and density of macroparticles reached the maximum and minimum respectively when the CrN film was deposited at a duty cycle of 75%, indicating that the macroparticles on its surface were in large sizes.