三重图样光刻与定向自组装技术下通孔层的分解

Contact layer decomposition of DSA with TPL

针对三重图样光刻和定向自组装技术下通孔层的掩模版和引导槽分配问题,首先为给定版图构造一个加权冲突分组图;然后,基于加权冲突分组图提出一个整数线性规划模型.同时,为了加快整数规划的求解速度,引入一些有效的不等式将一些不好的结果剪枝掉.对比当前相关工作,基于整数规划的方法可以减少42倍的冲突数目和78%的总成本.

We consider the contact layer mask and template assignment problem of directed-self-assembly with triple patterning lithography.To address this problem,we first construct the weighted conflict grouping graph.Then,we formulate this problem as an integer linear programming(ILP)and introduce some valid inequalities to prune poor solutions.Compared with the current related work,our results reduce 42 times the number of conflicts and 78%total cost.