摘要
综述了双氰胺、咪唑、酸酐、微胶囊等几类中温潜伏型固化剂在环氧树脂体系中的应用和改性研究进展,并对该类固化体系未来的研究发展方向作出了展望。
The application and modification progress of several kinds of medium temperature latent curing agents such as dicyandiamide,imidazole,acid anhydride and microcapsules in epoxy resin system were reviewed,and the future research directions of such curing systems were prospected.
作者
赵玉春
刘浩
李智慧
刘文涛
黄淼铭
何素芹
朱诚身
ZHAO Yu-chun;LIU Hao;LI Zhi-hui;LIU Wen-tao;HUANG Miao-ming;HE Su-qin;ZHU Cheng-shen(Institute of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001,China;Sinopec Zhongyuan Oilfield Company Petroleum Engineering Technology Research Institute, Puyang 457000, China;Henan Key Laboratory of Advanced Nylon Materials and Application ^Zhengzhou University) , Zhengzhou 450001, China)
出处
《热固性树脂》
CAS
CSCD
北大核心
2019年第4期66-70,共5页
Thermosetting Resin
基金
国家科技重大专项子项目(2016ZX05017-003)
关键词
环氧树脂
中温潜伏型固化剂
双氰胺
咪唑
酸酐
微胶囊
epoxy resin
medium temperature latent curing agent
dicyandiamide
imidazole
acid anhydride
microcapsule
