摘要
电子设备在工作时,各个模块上的元器件大部分都是热源,如功放管、变压器、FPGA芯片等,这些器件如果温度过高,就会工作异常甚至因温度过高而烧毁,因此要对它们采取散热措施,保证正常的工作温度,使电子设备在预定的环境条件下稳定可靠地工作,这就是散热设计的目的。本文将结合理论知识和工程设计实践,研究电子设备机箱的散热设计。
When the electronic equipment works,most of the components on each module are heat sources,such as power amplifier,transformer,FPGA chip,etc.If the temperature of these components is too high,they will work abnormally or even burn down because of the high temperature.Therefore,we should take heat dissipation measures to ensure the normal working temperature and make the electronic equipment work steadily and reliably under the predetermined environmental conditions.The purpose of heat dissipation design.In this paper,the heat dissipation design of electronic equipment chassis will be studied based on theoretical knowledge and engineering design practice.
作者
王英杰
Wang Yingjie(Tianjin Jingxin Communication System Co.,Ltd.Guangzhou Branch,Guangzhou Guangdong,510000)
出处
《电子测试》
2019年第16期5-6,31,共3页
Electronic Test
关键词
电子设备
机箱
散热
热设计
electronic equipment
chassis
heat dissipation
thermal design