小口径智能弹药发射高过载环境下弹载模块电路应力分析

Analysis on Stress for Circuit Module Under Launching High Overload Environment in Small Caliber Smart Bullet

针对小口径智能弹药发射时弹载元器件极容易发生损坏失效的问题,对其高过载环境下弹载模块电路应力进行分析。设计弹药弹载电路模块的防护结构,采用HYPERMESH与ABASQUS软件建立弹丸和刚体滑膛身管的有限元模型,得到弹载电路的应力分布,计算不同防护外壳厚度下弹载电路模块的应力响应,并对聚氨基甲酸乙酯、丙烯酸、硅酮和环氧树脂等灌封材料进行有限元数值仿真。该分析可为后续弹丸弹载模块的设计提供参考。

Aiming at the problem of damage and invalidation of projectile-borne circuit module when launching small caliber smart bullet, focus on the analysis of the stress of the circuit module at the high overload environment. Designed a protection structure for projectile-borne circuit module, use HYPERMESH and ABAQUS to establish finite element model of the bullet and the rigid slippery barrel, calculated the stress distribution of the circuit module. Analyzed the stress response of the circuit module under different protective shell thickness and 4 kinds of potting materials: polyurethane, acrylic acid, silicone and epoxy resin. The results can provide a reference for the design of projectile-borne circuit module.