一种新型结构聚酰亚胺的合成与表征

Synthesis and Characterization of a New Structure Polyimide

以2,3,3',4'-二苯醚四甲酸二酐(a-ODPA)和4,4′-二氨基二苯醚(ODA)为单体原料,在二甲基乙酰胺(DMAC)中聚合,通过化学亚胺化合成了一种新型聚酰亚胺,并在高温高压下模塑成型.通过热重分析(TGA)、差示扫描量热分析(DSC)和动态机械分析(DMA)等,对该聚酰亚胺的热性能进行了研究,并将其与以3,4,3',4'-二苯醚四甲酸二酐(s-ODPA)和ODA为单体原料合成的聚酰亚胺(牌号:YS20)进行比较.结果表明该聚酰亚胺具有良好的机械性能、热性能和加工性能,可以广泛应用于航空航天、飞机、汽车、微电子等领域.

The new polyimide was synthesized from 2,3,3′,4′-diphenylether tetracarboxylic dianhydride(a-ODPA)and 4,4′-diaminodiphenylether(ODA) by polymerization in dimethylacetamide(DMAC) using chemical imidization, and it was molded under high temperature and pressure. The thermal properties of the polyimide were studied by thermogravimetric analysis(TGA), differential scanning calorimetry(DSC) and dynamic mechanical analysis(DMA) testing,and were compared with the YS20 polyimide prepared from 3,4,3′,4′-diphenylether tetracarboxylic dianhydride(s-ODPA)and 4,4′-diaminodiphenylether(ODA). The new polyimide exhibits good mechanical properties, thermal properties and processing properties, and can be widely used in aerospace, aircraft, automobile, microelectronics and other fields.