添加剂对无氰电镀Cu-Zn合金镀层性能的影响

Effect of Additives on the Properties of Cyanide-Free Electroplating Cu-Zn Alloy Coatings

采用单因素实验考察了光亮剂二氧化硒、2-巯基苯并咪唑、苯骈三氮唑聚以及表面活性剂OP-10、十二烷基硫酸钠、十二烷基苯磺酸钠、吐温80添加剂对无氰电镀Cu-Zn合金镀层光泽度的影响。通过采用正交试验研究了添加剂对镀层的光亮度、结合力、外观形貌及镀液性能的影响,得到较优的添加剂量为:8mg/L二氧化硒、1.5mg/L2-巯基苯并咪唑、90mg/L十二烷基苯磺酸钠、50mg/L吐温80;加入较优的复配添加剂后镀层的光泽度为248Gs,结合力、镀液性能优良以及外观形貌平整、细致。镀液基础配方:30g/L硫酸铜、9g/L硫酸锌、90g/L酒石酸钾钠、35g/L草酸钾、15g/L乳酸、20g/L碳酸钾,工艺条件:pH12.4、温度40℃、电流密度4A/dm2、施镀5min。

The single factor experiments were used to investigate the effects of brighteners selenium di. oxide,2-mercaptobenzimidazole,benzotriazole polymerization and surfactant OP-10,lauryl sodium sulfate,SDBS,Tween 80 additive on the gloss of cyanide-free Cu-Zn alloy coatings. The effects of addi. tives on the luminance,adhesion,appearance and bath properties of the coatings were studied by orthog. onal tests. The optimal additive amount was as follows:8 mg/L selenium dioxide,1.5 mg/L 2-methylphenyl- benzidine,90 mg/L SDBS,50mg/L Tween 80. After the addition of better additives,the gloss of the coatings was 248 Gs,and the coatings had binding force,excellent bath performance,smooth and fine appearance. The basic formula of the plating solution was as follows:30 g/L copper sulfate,9 g/L zinc sulfate,90 g/L potassium sodium tartrate,35 g/L potassium oxalate,15 g/L lactic acid,20 g/L po. tassium carbonate,and the process conditions were as follows:pH 12.5,temperature of 40 ℃,the cur. rent density of 4 A/dm2,and the plating time of 5 min.