5G无损铜之铜面键合剂的使用

Application of copper surface bonding agent without any copper loss in 5G

随着5G技术的发展,信号传导对铜面质量的要求越来越高。铜面键合剂与传统的粗化药水相比,不增加铜面粗糙度,不影响高频信号的传输速度。同时,通过化学键的作用,增强前处理工序中铜面与干膜、湿膜以及防焊层的结合力。

With the development of 5G communication technology, the requirements for copper surface quality became much more exigent because of signal transition. Compared with traditional roughing solution, the copper surface bonding agent did not increase the surface roughness, and thus had no influence on signal transition. At the same time, the adhesion strength between copper and dry film/wet film/solder mask increased through the chemical bonding interaction when bonding agent applied.