摘要
为揭示碳化硅陶瓷超声振动辅助磨削材料去除特性,开展了光滑粒子流体动力学(SPH)单颗金刚石磨粒划擦仿真模拟,同时构建了超声振动划擦试验台,进行了单点金刚石超声振动划擦试验研究。结果发现:超声振动划擦中,材料去除根据切深的不同分为断续切削模式及连续切削模式;无超声作用划擦中的材料仅存在连续切削去除模式;超声振动作用的碳化硅陶瓷延性-脆性转移深度大于无超声作用下的延性-脆性转移深度。此外,通过碳化硅陶瓷超声内圆磨削试验结果同样发现超声振动作用下的延性-脆性转移深度变大,说明超声振动辅助磨削更容易实现延性域磨削。
In order to investigate the material removal behavior in ultrasonic assisted grinding of SiC ceramics, simulation of the ultrasonic-assisted scratching using the smooth particle hydrodynamics (SPH) are operated. Meanwhile, the ultrasonic-assisted scratching tests are operated on the constructed ultrasonic assisted scratching (UAS) unit for comparison. The results show that there are two scratching modes in the UAS process:An intermittent mode and a continuous mode. The critical depth of cut in UAS is deeper than that in conventional scratching and ultrasonic assisted internal grinding of SiC ceramics. This study confirmed that ultrasonic assisted grinding can easily achieve the ductile grinding.
作者
曹建国
张勤俭
CAO Jianguo;ZHANG Qinjian(School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044;Key Laboratory of Vehicle Advanced Manufacturing, Measuring and Control Technology, Ministry of Education, Beijing Jiaotong University, Beijing 100044)
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2019年第13期205-211,共7页
Journal of Mechanical Engineering
基金
中央高校基本科研业务费专项资金资助项目(M17RC00020)
关键词
超声振动
磨削
碳化硅陶瓷
材料去除
ultrasonic vibration
grinding
SiC ceramics
material removal
