基于专用芯片H032A的失效分析

Failure Analysis Based on Special Chip H032A

针对专用芯片H032A出现的单通道或者多通道失效和噪声过大的失效问题进行了分析。通过专用软件测试、非破坏性检测和开封及镜检等技术手段,确定失效原因由芯片的焊点不实和芯片空洞所致;提出了使用预成型焊片减少芯片在回流焊中因助焊剂高温裂解产生气泡造成空洞问题的解决方案。

This paper deeply researched the failure problem of single channel, multi-channel and excessive noise. Through special soft testing,non-destructive testing, unsealing and microscopic inspection, the failure causes are determined to be improper solder joints and voids in the chip.Finally, the paper proposed a solution of using pre-formed solder sheets in order to reduce voids problem which is caused by propellants cracking bubbles generated in the high temperature chip reflow soldering.