石墨烯/热塑性聚氨酯导电复合材料的制备及压阻特性研究

Preparation and piezoresistive property of graphene/TPU conductive composite

采用硅烷偶联剂KH550对石墨烯进行接枝改性,采用溶液共混法制备改性石墨烯/热塑性聚氨酯(TPU)导电复合材料,并对复合材料的微观结构、电学性能及压阻特性进行测量和分析。研究表明:硅烷偶联剂KH550成功接枝至石墨烯的表面,分散性较好,复合材料的渗流阈值在石墨烯添加量为5%(wt,质量分数)附近,在石墨烯添加量为7%(wt,质量分数),压力为1.0MPa条件下,石墨烯/热塑性聚氨酯复合材料的均一化电阻为1.55,循环5次后的电阻为390Ω,具有较好的压阻重复性。

graphene was modified by KH550,the conductive graphene/TPU composite thin films were prepared by solution mixing method.The microstructure,electrical properties and piezoresistive characteristics of the film were measured and analyzed.The results showed that silane coupling agent was successfully grafted onto the surface of graphene,The modified graphene can be uniformly dispersed into the TPU matrix.The percolation threshold of the composite was near 5wt%.When the graphene mass content was 7wt%,under the pressure of 1.0MPa,the uniform resistance of composite was 1.55,the resistance was of composites 390Ωafter being circulated for 5times.And composites showed good piezoresistive repeatability.