新型八工位高效内圆切片机的设计与优化

Design and Optimization of Eight Position High Efficiency Inner Circular Slicer

目前,市场上所采用的传统内圆切片机的切割效率已无法满足单晶硅片的需求量。针对这种情况,设计了一台新型八工位高效内圆切片机,可同时进行8块物料的加工,加工效率提高了8倍。同时,为降低机床的振动,提高硅晶片的加工质量,采用响应面法和遗传算法(NSGA-Ⅱ)对床身的固有频率和质量进行多目标优化。通过优化使床身的前3阶固有频率分别提高了35.1%、65.9%、56.4%,同时床身质量减轻了60 kg,机床的整体性能得到了优化。

At present, the cutting efficiency of the traditional circular slicer used in the market can not meet the demand of the increasing monocrystalline silicon wafers. In view of this situation, a new type of high efficiency inner circular slicer which has eight positions is designed. It could process eight pieces of materials at the same time and the productivity was increased by eight times. At the same time, in order to reduce the vibration of the machine tool and improve the precision of the silicon wafer, the natural frequency and quality of the bed were optimized with multi-objective by the response surface method and the genetic algorithm (NSGA-II). Through optimization,the first to third order natural frequencies of the bed are increased by 35.1%, 65.9%, 56.4% respectively, and the weight of the bed is reduced by 60 kg. The overall performance of the machine tool is optimized.