PMI结构泡沫在航天电子模块散热和轻量化设计中的应用

Application of Polymethacrylimide(PMI) Foam in Heat Dissipation and Lightweight Design of Aerospace Electronic Module

随着载人航天技术的发展,以及综合一体化理念向航天电子系统领域的延伸,航天电子设备的性能和功能越来越强大,对电子模块的重量、体积、散热能力等指标提出了越来越高的要求。通过分析PMI结构泡沫的性能特点,设计了基于PMI泡沫和热管的电子模块结构。通过实物研制和试验测试,分析了该种结构在散热方面和轻量化方面相比于铝合金结构电子模块的优缺点,为航天电子设备兼顾散热和轻量化的设计需求提供了新的解决途径。

With the development of manned space technology and the extending of comprehensive integration to the aerospace electronic system, the performance and function of aerospace electronic equipment are getting better, which in turn place higher demands on the parameters of electronic modules such as weight, volume and heat sinking. By analyzing PMI’s performance, the structure of electronic modules was designed based on PMI foam and heat pipes. Through physical development and testing, the advantages and disadvantages of the structure were studied comparing it with the aluminum alloy structure in terms of heat dissipation and lightness of weight. This serves as a solution for the aerospace electronic equipment to meet the both requirements of heat dissipation and lightweight.