纳小型连接器接插真空电镀技术

Vacuum Electroplating Technology for Small-sized Connectors

如今连接器在科学领域越来越趋近于多元化、微小化,成为发展新型连接器研究方向。而连接器的连接技术是我们需要突破的地方,怎么更小更稳定信号或者电流的更均匀无损尤为重要,许多纳米级连接器技术就这样孕育而生。本文介绍了纳小型连接器接插真空电镀技术是技术路线、创新点、实施方案。

Nowadays, connector is becoming more and more diversified and miniaturized in the field of science, and it has become the research direction of developing new connector. The connection technology of connector is the place where we need to make breakthroughs. It is particularly important to make the signal smaller and more stable or the current more lossless. Many nanoscale connector technologies are born in this way. This paper introduces the technical route,innovation point and implementation scheme of vacuum electroplating technology fornanometer connector.