摘要
IC导线架产品光架冲裁时易产生扬屑、翻屑、塞屑等异常现象,若发现和处理不及时,很容易导致大量冲裁凸模崩刃甚至断裂。通过改善冲裁凸模的形状,以防止冲裁凸模与凹模之间形成真空,进而导致开模时扬屑现象的产生。经生产验证,模具运行平稳,完全无扬屑现象再次出现,达到产品的量产要求。
The abnormal phenomena of chip lifting, chip turning and chip plugging are easy to occur in the blanking process of IC wire rack products.If it isn’t found and handled in time, it is easy to cause a large number of blanking punches to collapse or even break. By improving the shape of the punch, the vacuum between the punch and the die can be prevented, which will lead to chip lifting when the die sinking. Through production verification,the die runs smoothly and no chip phenomenon occurs again, which meets the requirement of mass production.
作者
刘榕
LIU Rong(Zhongshan Fusheng Electronics Corporation, Zhongshan 528437,China)
出处
《机电工程技术》
2019年第8期260-262,共3页
Mechanical & Electrical Engineering Technology
关键词
扬屑
冲裁凸模
真空
flying chip
stamping terrace die
vacuum
