HIPSN陶瓷磨削力与温度的实验研究

Experimental Study on Grinding Force and Temperature of HIPSN Ceramics

为了研究磨削参数对热等静压氮化硅陶瓷磨削温度与磨削力的影响以及磨削温度和磨削力与表面形成之间的关系。通过正交实验得出磨削参数与磨削温度、磨削力以及比磨削能的关系,而后得出比磨削能与表面成形的关系。当砂轮速度由30m/s增大到45m/s,法向磨削力由241.4N减小到185.3N,切向磨削力由83.5N减小到58N,磨削温度由268℃增加到370.5℃,比磨削能由179.14J/mm^-3增加到238.88J/mm^-3,表面质量变好。磨削深度由5μm增加到35μm,法向磨削力由178.15N增加到274.6N,切向磨削力由40.88N增加到115N,磨削温度由77.75℃增加到593℃;比磨削能由335.74J/mm^-3减小到100.72J/mm^-3,表面质量变差。工件进给速度由1000mm/min增大到7000mm/min,法向磨削力由185.13N增加到256.05N,切向磨削力由47.48N增加到91.08N,磨削温度先由352.25℃减小到308℃,后增加到325.75℃,比磨削能由376.2J/mm^-3减小到94.98J/mm^-3,表面质量变差。当比磨削能较大时,表面以塑性变形的方式去除,比磨削能较小时,表面以脆性断裂的方式去除。在陶瓷磨削加工中尽可能选择小切深和较缓的工件进给速度,并适当提高砂轮线速度。

In order to study the effect of grinding parameters on the grinding temperature and grinding force of hot isostatic pressed silicon nitride ceramics and the relationship between grinding temperature, grinding force and surface formation. Through the orthogonal experiment, the relationship between the grinding parameters and the grinding temperature, the grinding force and the specific grinding energy were obtained. And then the relationship between the specific grinding energy and the surface formation was obtained. When the grinding wheel speed was increased from 30 m/s to 45 m/s, the normal grinding force was reduced from 241.4 N to 185.3 N. The tangential grinding force was reduced from 83.5 N to 58 N. The grinding temperature was increased from 268 ℃ to 370.5 ℃. The specific grinding energy was increased from 179.14 J/mm^-3 to 238.88 J/mm^-3 . And the surface quality became better. When the grinding depth was increased from 5 μm to 35 μm, the normal grinding force was increased from 178.15 N to 274.6 N. The tangential grinding force was increased from 40.88 N to 115 N. The grinding temperature was increased from 77.75 ℃ to 593 ℃. The specific grinding energy was reduced from 335.74 J/mm^-3 to 100.72 J/mm^-3 . And the surface quality was deteriorated. When the workpiece feed speed was increased from 1000 mm/min to 7000 mm/min, the normal grinding force was increased from 185.13 N to 256 N. The tangential grinding force was increased from 47.48 N to 91.08 N. The grinding temperature firstly was reduced from 352.25 ℃ to 308 ℃, and then was increased to 325.75 ℃. The specific grinding energy was reduced from 376.2 J/mm^-3 to 94.98 J/mm^-3 . And the surface quality is deteriorated. When the specific grinding energy is large, the surface is removed by plastic deformation. When the grinding energy is small, the surface is removed by brittle fracture. In the grinding process, the small depth of cut, the slower workpiece feed speed and the high grinding wheel speed are selected as appropriately.