基于分子动力学的SiC刀具切削单晶镍刀具磨损分析

Wear Analysis of SiC Cutting Tool in Cutting Single Crystal Nickel Based on Molecular Dynamics

通过MD仿真,分析了SiC刀具切削单晶镍,刀具磨损过程中原子的物理化学状态。研究发现,在切削过程中,工件镍原子发生物理移动并与刀具中的硅化学结合;根据径向分布函数分析法以及MD仿真结果,证实了Ni-Si键的生成;切削用量影响这一结果,切削深度越大,刀屑界面的NiSi化合物生成速率越明显,但对最终生成量多少的影响并不显著。而且NiSi化合物硬度低于刀具硬度,随着切深越大,磨损加剧。

This paper analyzes the physical and chemical states of atoms in the process of cutting single crystal nickel with SiC tool and tool wear by MD simulation. It is found that during the cutting process, the nickel atoms of the workpiece move physically and combine with silicon in the tool. According to the radial distribution function analysis and MD simulation results, the formation of Ni-Si bond is confirmed. The larger the depth of cut, the more obvious the NiSi compound formation rate at the chip interface, but the impact on the final output is not significant. Moreover, the hardness of the NiSi compound is less than that of the tool, and the wear increases with the cutting depth.