温度对减载组件减载性能影响

Temperature Effect on Performance of Load Shedding Subassembly

为研究不同温度对减载组件减载性能的影响,通过分离式霍普金森压杆装置、高低温箱和高速摄像机等多种测试手段并用,得到不同温度环境下经减载组件减载作用后弹载器件上的输出应力和应变。建立考虑温度影响的加装减载组件弹载器件非线性动力学模型,利用特征线的相容关系对方程进行理论求解,得到弹载器件结构动态响应。结果表明:随着环境温度降低,作用在弹载器件上的应力会明显增大,而且温度变化对波阻抗大的减载组件材料影响较小,而对波阻抗小的减载组件材料影响较大。

In order to study the effect of different temperatures on the load-shedding performance of load-shedding components, the output stresses and strains of missile-borne devices after load-shedding of load-shedding components under different temperature environments were obtained by means of a combination of separate Hopkinson pressure bar device, high and low temperature chambers and high-speed camera. A non-linear dynamic model of missile-borne devices with load-shedding components was established with the consideration of temperature effect. The equation can be solved theoretically by using the compatibility relation of characteristic lines, with the structural dynamic response of missile-borne devices obtained.The results show that with the decrease of ambient temperature, the stress acting on the missile-borne components will increase obviously, and the temperature change has less influence on the material of load-reducing components with large wave impedance, but greater influe-nce on the material of load-reducing components with small wave impedance.