非离子表面活性剂对铝栅化学机械平坦化的影响

Effect of nonionic surfactant on chemical mechanical planarization of aluminum gate

采用由5%(体积分数,下同)硅溶胶磨料、4%H2O2、1%FA/O型螯合剂和0.0%~2.5%多元胺醇型非离子表面活性剂组成的抛光液对铝栅表面进行化学机械平坦化处理。工艺条件为:工作压力13.79 kPa,抛头转速55 r/min,抛盘转速65 r/min,抛光液流量150 mL/min,时间180 s。研究了抛光液中非离子表面活性剂体积分数对铝片去除速率、表面粗糙度和润湿性的影响。随着非离子表面活性剂体积分数的增大,铝片的去除速率呈缓慢下降的趋势,表面粗糙度先减小后略增,对抛光液的接触角减小。抛光液中非离子表面活性剂积分数为2.0%时,铝片对其接触角为11.25°,抛光后的表面粗糙度(Ra)为2.3 nm。

The chemical mechanical planarization of aluminum gate was conducted with a solution comprising silica sol 5vol.%,H2O2 4vol.%,FA/O chelating agent 1vol.%,and multiple amino alcohol nonionic surfactant 0.0-2.5vol.%under the following conditions:working pressure 13.79 kPa,rotation rate of polishing head 55 r/min,rotation rate of polishing disk 65 r/min,flow rate of polishing solution 150 mL/min,and time 180 s.The effect of the volume fraction of nonionic surfactant in polishing solution on the removal rate,surface roughness,and wettability of aluminum plate was studied.With the increasing of the volume fraction of nonionic surfactant,the removal rate of aluminum was decreased slowly,the surface roughness was decreased initially and then increased slightly,and the contact angle of polishing solution to the surface of aluminum plate was decreased.The contact angle of polishing solution containing 2.0vol.%of nonionic surfactant to aluminum plate was 11.25°,and the surface roughness(Ra)of polished aluminum plate was 2.3 nm.