基于应力失效的非固体电容器装配质量的改进

Improvement of Assembly Quality of Non-solid Capacitors Based on Stress Failure

通过对生产流程的梳理和对电磁锁定功能异常的失效分析、排查及机理分析,对基于应力失效的非固体电容器的引线断裂各项因素进行了逐一排查,最终完成了电磁锁定功能异常的故障定位。同时,对引发该类故障的关键因素或关键参数均采取了可靠、有效的工艺改进措施进行技术保障,既进行成型工装设计保证了元器件的成型质量,又对胶液涂敷进行了一致化规范操作。上述改进措施均经批量产品实施验证,从根本上解决了因应力因素致元器件引线断裂失效而引发的锁定功能异常故障的发生,有效且可靠。此分析方法对于类似质量问题的排查具有一定的借鉴和指导意义。

Through the process of production carding and the failure analysis,check and mechanism analysis of the electromagnetic locking function abnormality,the every factors of lead breakage of non-solid capacitor based on stress failure were checked,the fault location was carried out.At the same time,the reliable and effective process improvement measures were taken for the key factors causing the fault.This measure can not only ensure the forming quality of components by designing forming tooling,but also carried out uniform and standardized operation on glue solution coating.Through verifying of the batch products,it was very effective and reliable to solving the problem of abnormal locking function caused by failure of components due to stress factors.The analysis method had certain reference and guiding significance for the investigation of similar quality problems.