紫铜超声波焊接工艺及成形机制

Ultrasonic welding process and forming mechanism of copper

研究了T2紫铜超声波焊接的工艺及成形机制,采用拉伸试验研究了不同焊接时间和不同焊接压力下焊接接头的力学性能,采用光学显微镜观察接头金相组织,采用电子背散射衍射(EBSD)观察接头晶粒变化。结果表明:焊接压力及焊接时间对金属焊接质量有重大影响,当焊接时间为500ms、焊接压力为0.5MPa、焊接功率为1400W时,接头的力学性能最高,焊缝结合最好;在超声波焊接过程中,焊接界面先出现机械嵌合,随着焊接能量的增加,最后达到原子间的结合;焊接界面处由于发生动态再结晶,形成了大量细小无畸变新晶粒,亚晶形核是再结晶形核的一种重要形式。

The process and forming mechanism of T2 copper ultrasonic welding were investigated.The mechanical properties of welded joints were researched under different welding times and different welding pressures by Tensile tests.Meanwhile,the metallographic structure of joints was observed by optical microscope,and the joint grain changes was observed by Electron Backscattered Diffraction (EBSD).The results showed that welding pressure and welding time have a significant impact on the quality of metal welding.When the welding time was 500 ms,the welding pressure was 0.5 MPa,and the welding power was1 400 W,the mechanical properties of the joint were the highest and the weld seam was best.The welding interface appeared mechanically at first in the ultrasonic welding process and with the welding energy increased and reached the atomic bond finally.A number of small and distortion-free new grains were formed at the welding interface due to dynamic recrystallization.Metamorphic nucleation was an important form of recrystallized nucleation.