氮化铝覆铜板在空间热场下热学性能的模拟仿真及实验验证

Simulation and Experimental Verification of Thermal Property for Aluminum Nitrides and Copper Clad Laminates under Space Thermal Environment

氮化铝(AlN)陶瓷具有高导热、高电阻率、良好的尺寸稳定性以及优异的力学性能等特性,被认为是新一代高性能陶瓷基板和封装的首选材料。本研究探讨了高性能陶瓷在空间电子系统的应用潜力,对AlN材料的基础性能进行了分析,重点分析了AlN陶瓷材料及其覆铜板的热传导性能,从理论上分析了AlN材料及覆铜板的热特性,并通过仿真模拟对理论值进行了分析验证,最后探讨了AlN陶瓷覆铜板在空间热循环模拟环境下的热传导性能。结果表明AlN陶瓷的导热系数高达174.1W?m–1?K–1,覆铜板比纯氮化铝陶瓷具有更高的热扩散系数,而热特性的仿真结果与理论计算一致。最后空间环境模拟试验表明, AlN材料在温度循环环境下的热传导性能非常稳定。

Aluminum nitrides(AlN), which possess high thermal conductivity, high electrical resistivity, good dimensional stability and excellent mechanical property, have been considered the preferred materials as a new generation of high-performance ceramic substrate and packaging materials. In this paper, the application potential of ceramics in space electronic systems is discussed. And the basic capabilities of AlN were analyzed. Heat transfer property of AlN and its copper clad laminate were of selective and theoretical analysis, which were further verified by simulation. Finally, the thermal conductive performance of AlN in the simulated space thermal cycle environment was discussed. The results show that the thermal conductivity is up to 174.1 W×m–1×K–1 and the thermal diffusivity of copper clad laminates is higher than that of pure aluminum nitrides. The simulation results of thermal characteristics are in agreement with the theoretical calculation. The final space environment simulation tests indicate that the thermal conductive capabilities of aluminum nitrides remain extremely stable.