基于ANSYS的电缆接头典型绝缘缺陷电-热场仿真研究

Electrical-Thermal Simulation of Typical Insulation Defects in Cable Joints Based on ANSYS

为预防绝缘缺陷引起的故障,对主绝缘划伤、含杂质、绝缘受潮和半导体尖端4种典型的绝缘缺陷进行电场和温度场仿真。通过对比有无缺陷时场强和温度的变化,利用特征线对比描述场强的畸变程度。仿真结果显示:即使微小的缺陷也会引起场强和温度的突变,对温度的影响稍微较小,其中接头受潮缺陷对场强影响最突出,半导体尖端缺陷对温度影响最大。随着缺陷大小的不同,场强畸变和温度变化程度也不同。本研究可为电缆接头局部放电监测和接头维修预防等提供理论参考。

In order to prevent faults caused by insulation defects,electric field and temperature field simulations are performed on four typical insulation defects: main insulation scratches,impurities,insulation moisture and semiconductor tips. By comparing the field strength and temperature changes with or without defects,the characteristic linesare utilized to describe the degree of distortion of the field strength. The results show that even small defects can cause mutations in field strength and temperature,and the effect on temperature is slightly smaller. The moisture defect of the joint has the most prominent influence on the field strength,and the semiconductor tip defect has the greatest influence on temperature. Field distortion and temperature changes vary with the size of the defect. It can provide theoretical reference for partial discharge monitoring of cable joints and joint maintenance prevention.