基于电磁-温湿度耦合的三维开关柜温湿度分布仿真研究

Simulation Study on Three Dimensional Switchgear Temperature & Humidity Distribution Based on Electromagnetic-Temperature-Humidity Coupling Calculation

开关柜内部温湿度分布是决定其凝露是否形成的关键参数。为获取开关柜内部的温湿度分布,建立了简化的高压开关柜三维仿真计算模型,基于电磁-温湿度多物理场耦合方法,计算了开关柜母线流过正常工作电流时其内部的温湿度分布,研究了加热及通风装置对开关柜内部温湿度分布的影响。仿真结果表明,断路器触头盒表面湿度较高,是容易发生凝露的位置。增加加热和通风装置可有效改善开关柜内部绝缘材料表面的温湿度分布,进而降低开关柜内部凝露的发生概率。

Temperature and humidity distribution in switchgear are the key parameters to determine whether condensation is formed or not.In order to obtain the temperature and humidity distribution inside the switch cabinet,a simplified three-dimensional simulation model with high-voltage switch cabinet is established.Based on the electromagnetic-temperature-humidity multi-physical field coupling method,the temperature and humidity distribution inside the switch cabinet are calculated when the operating current flows through the busbar.The influence of heating and ventilation devices on temperature and humidity distribution inside the switch cabinet is further studied.The simulation results show that the humidity on circuit breaker contact box surface is high,and the condensation is easier to form.Increasing heating and ventilation devices can effectively improve the temperature and humidity distribution on insulation surface in switchgear cabinet,thereby reducing the probability of condensation in switchgear cabinet.