导电胶固化工艺的研究

Study on the Curing Processes of Conductive Adhesives

导电胶是由导电填料分散在树脂基体中,经过固化后形成的具有导电性能的复合材料,它是一种非常重要的无铅连接材料。本文概述了导电胶的两种不同的固化工艺,即热固化工艺和光固化工艺,并阐述了其固化动力学特性,展望了导电胶固化技术未来的发展趋势。

Conductive adhesive,which is a kind of a conductive composite material formed by curing conductive filler in resin matrix,is a very important lead-free bonding material.In this paper,different curing processes of conductive adhesives are summarized,including thermal curing and UV curing.The curing kinetic properties are described,and the development trend of curing processes of conductive adhesive was prospected.