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Te-free SbBi thin film as a laser heat-mode photoresist 被引量:1

Te-free SbBi thin film as a laser heat-mode photoresist
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摘要 A Te-free binary phase change material Sb Bi is proposed as a new inorganic photoresist for heat-mode lithography. It shows good film-forming ability(surface roughness <1 nm), low threshold power for crystallization(2 m W), and high etching selectivity(15:1). Line-type, dot-type, and complex pattern structures with the smallest feature size of 275 nm are fabricated on Sb Bi thin films using a 405 nm diode laser direct writing system. In addition, the excellent grating structures with a period of 0.8 μm demonstrate that thermal interference does not affect the adjacent microstructures obviously. These results indicate that Sb Bi is a promising laser heat-mode resist material for micro/nanostructure fabrication. A Te-free binary phase change material Sb Bi is proposed as a new inorganic photoresist for heat-mode lithography. It shows good film-forming ability(surface roughness <1 nm), low threshold power for crystallization(2 m W), and high etching selectivity(15:1). Line-type, dot-type, and complex pattern structures with the smallest feature size of 275 nm are fabricated on Sb Bi thin films using a 405 nm diode laser direct writing system. In addition, the excellent grating structures with a period of 0.8 μm demonstrate that thermal interference does not affect the adjacent microstructures obviously. These results indicate that Sb Bi is a promising laser heat-mode resist material for micro/nanostructure fabrication.
作者 张奎 王正伟 陈国东 王阳 曾爱军 朱菁 Syarhei Avakaw Heorgi Tsikhanchuk Kui Zhang;Zhengwei Wang;Guodong Chen;Yang Wang;Aijun Zeng;Jing Zhu;Syarhei Avakaw;Heorgi Tsikhanchuk
出处 《Chinese Optics Letters》 SCIE EI CAS CSCD 2019年第9期105-108,共4页 中国光学快报(英文版)
基金 partially supported by the National Natural Science Foundation of China(Nos.51672292and 61627826) the International Science&Technology Cooperation Program of China:Intergovernmental International Cooperation Program in Science and Technology Innovation(No.2016YFE0110600) the International Science&Technology Cooperation Program of Shanghai(No.16520710500)
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