服务器主板阻焊半塞孔饱满度工艺研究

Research on solder mask semi-plugging hole plumpness of server board

服务器主板的主要特点是板面积较大,通常面积都在0.15 m2以上,因此对于PCB增加了制造难度,其中对于阻焊半塞孔饱满度的控制方面就是一个难点。本文主要针对PCB盘中孔等类型的油墨半塞孔的设计选择以及半塞孔过程控制进行DOE试验,寻求一条最佳的控制半塞孔饱满度的工艺路线,从而为服务器板的阻焊塞孔制作提供工艺指引。

The main feature of server motherboard is larger area,usually with an area of more than 0.15 square meters.It does increase the difficulty of manufacturing.And the control of semi-plugging plumpness of hole in solder mask process is one of the difficulties.This paper mainly describes about using DOE to check what the best choices of semiplugging plumpness of hole in some specified designs,seeking an optimal control process parameter,so as to provide process guideline of server.