PCB图形电镀中表面铜瘤的成因与改善

The reason and improvement of copper nodules in PCB pattern plating

电镀表面铜瘤是PCB制程中常见的异常问题,不仅降低AOI检测和检修的效率,而且还严重影响品质,从而造成板件的报废和人力、物力的损失。文章通过客户端的实际生产条件,从水质、添加剂、物料、日常维护保养上分析铜瘤产生的影响原因,并针对性给出改善对策和建议。

Electroplated copper nodules are common abnormal problems in PCB manufacturing process,which not only decrease the efficiency of AOI inspection and repair,but also severely affect the quality,and resulting in the scrapping of plates and the loss of manpower and material resources.In this paper,it analyzes the causes of copper wire and copper particles from the aspects of water quality,additives,material and daily maintenance according to the actualmanufacturing conditions of clients,and gives some targeted suggestions for improvement.