摘要
金丝互联技术是微波组件射频互联的关键手段,金丝键合质量直接影响微波组件的可靠性和微波特性。针对某产品金丝断裂现象进行分析,给出了异质材料金丝弧高对产品微波组件可靠性的影响,采用仿真优化及可靠性试验,提出了异质材料金丝弧高要求,提高了产品可靠性。
Gold wire bonding is a key means in the RF interconnection of microwave modules.The quality of gold wire bonding directly affects the reliability and microwave characteristics of microwave modules. The disconnection of the gold wire in a product is analyzed,and the impacts of the loop height of bonding wires is given on the reliability of the microwave modules.By the simulation optimization and reliability test, the requirement of the loop height of gold wire of different materials is given so as to improve the reliability of products.
作者
卢宏超
王恩浩
黄巍
LU Hongchao;WANG Enhao;HUANG Wei(The 2nd Military Representative Office in Chengdu of the Military Representative Bureau in Chongqing of the Army Equipment Department 2,Chengdu 610036,China;The 2nd Military Representative Office in Kunming of the Military Representative Bureau in Chongqing of the Army Equipment Department 2,Chengdu 610036,China)
出处
《电子工艺技术》
2019年第5期253-255,278,共4页
Electronics Process Technology
关键词
金丝互联
微波组件
异质材料
wire bonding
microwave module
different materials
